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Discover how to make every electron count at the newest member of the Titan family: TitanT G2 80-200 with ChemiSTEMT Technology. Combining FEI's groundbreaking ChemiSTEM Technology with Titan's market-leading sub-atomic resolution imaging, Titan G2 80-200 offers highly sensitive, fast elemental mapping, superior ultra-low concentration detection and the highest analytical probe current available. Even EDX tomography is easily achieved with stunning results.Make Every Electron Count ChemiSTEMTM TechnologyGaAs Atomic EDX showing 1.4 Angstroms dumbbells with Titan G2 80-200 with ChemiSTEM TechnologySample courtesy of Ionela Vrejoiu and Eckhard Pippel, Max Planck Institute of Microstructure Physics, Halle/Saale, Germany.La1-xSrxMnO3/SrRuO3 multilayer/quantum well systems in [100] projectionCIRCLE NO. 26 OR ONLINE:

FORFREEPRODUCTINFORMATIONVISITOURWEBSITE: www.microscopy-analysis.comwhat's newWHAT'SNEWMICROSCOPY AND ANALYSISNOVEMBER 2011293D Imaging Dual BeamFEI, a leading instrumenta-tion company providingelectron microscope systemsfor applications in researchand industry, has released itsnew Versa 3D DualBeam sys-tem, which provides high-resolution, three-dimen-sional (3D) imaging andanalysis on a wide range ofsample types. The Versa 3D'shighly configurable plat-form allows customers toadapt the system's capabili-ties to their specific require-ments. "The flexible configura-tion of the Versa 3D meetsthe demands of today'sresearchers who study awide variety of materials,"said Trisha Rice, vice presi-dent and general managerof FEI's Research BusinessUnit. "FEI's pioneering leadership in ion beam and electron beam techniques andmethodologies are well matched to give researchers information from even themost challenging samples. Last year, FEI introduced the latest generation HeliosNanoLab, the highest resolution DualBeam in the world that incorporates indus-try-leading electron and ion beam technologies, and today we are unveiling themost flexible DualBeam, the Versa 3D."Versa 3D is available with either high vacuum-only or high and low vacuumelectron imaging hardware. Low vacuum electron imaging capabilities allows thesystem to accommodate contaminating or outgassing samples that are incom-patible with high vacuum operation. Low vacuum also provides the ability tocompensate for charge build up in non conductive samples even at the high cur-rents required for analysis techniques, such as energy dispersive (X-ray) spec-troscopy (EDS) and electron backscatter diffraction (EBSD).The Versa 3D combines FEI's leadership in Schottky field emission electronbeam and high throughput ion beam technologies into a configurable Dual-Beam system, setting a new standard for 3D characterization and analysis, site-specific sample modification and advanced sample preparation for transmissionelectron microscopes (TEMs) and atom probes. The high-performance platformcan also be configured with FEI's impressive low vacuum capabilities and evenenvironmental scanning electron microscopy (ESEM) for in situ analysis. Advanced SEM scanning and FIB patterning yield powerful imaging andmilling performance. New features, such as FEI's SmartSCAN and Drift CorrectedFrame Integration (DCFI), facilitate electron beam imaging of sample types witha range of different properties. Advanced backscattered electron, as well as sec-ondary electron and ion detectors, collect a wide variety of topographic, ele-mental and compositional information 'from every angle'. The combination of the latest AutoSlice & View G3 software option, the ver-satile electron imaging hardware and high throughput ion column enablesresearchers to capitalize on the charge balancing capabilities of ions and elec-trons. Milling (with positive ions) and imaging or drift suppression (with elec-trons) provides a unique synergy for automation of 3D serial slicing, imaging andanalysis of both electrically conductive and non-conductive samples. When com-bined with EDS or EBSD, FEI's EDS3 and EBS3 software options can also be usedto reconstruct elemental maps or crystallographic orientation data in 3D. The Versa 3D addresses the diverse needs in materials research, life sciences,electronics and geosciences. It is available for ordering immediately. Contact: FEI Company www.fei.comMagneticFieldCancellationTechnical Manufacturing Corporation(TMC) has improved upon the originaldesign of its Mag-NetX magnetic fieldcancellation system to allow for easierinstallation and service and to makeMag-NetX more adaptable to cus-tomers' changing needs. The stainlesssteel struts are now modular and inter-changeable and available in a varietyof lengths to accommodate virtuallyevery commercial SEM. In addition, anew modular corner piece is designedwith integrated electronics for easyinstallation and service. TMC developed Mag-NetX toactively compensate for magnetic fieldfluctuations caused by nearby machin-ery, elevators, power lines, and otherexternal sources. Such sources candiminish the performance of scanningand transmission electron microscopes,electron beam lithography systems,focused ion beam instruments, andother tools that incorporate a chargedbeam.The open cube-shaped Mag-NetXdetects magnetic fields and sends outan equal and opposite field to cancelthe interference. The system consists ofa dedicated controller with automatedcalibration and self-test features, ACand DC magnetic sensor, andHelmholtz coils in a structural casing. Itcan be floor-,wall-, or tool-mountedand sized to user-specific require-ments. The system is dynamic, continu-ously monitoring and achieves 35-40dB of attenuation. Contact: Technical ManufacturingCorporation www.techmfg.comSample ViceThe Micro Vice sample holder from STJapan is a simple yet versatile tool toadjust and hold samples accurately foranalysis with light microscopes, stereo-microscopes and FTIR- and Ramanmicroscopes. It efficiently supportsmicroscope analysis of difficult shapedsamples, fibers and films and all kind ofsamples up to a diameter of 40 mm.The Micro Vice: holds round andunevenly shaped samples such astablets, minerals, etc. in the desiredposition; stretches accurately and holdspolymer films, fibers, hair, etc.; and tiltssamples for correcting oblique sampleorientation.In microscopical analysis it is oftenchallenging to securely place your sam-ples, such as tablets, gem stones, filmsor fibers in the exactly desired position.With the MicroVice it is easy to holdround samples such as tablets undercompression in the desired position,hold films and other flexible materialsunder tension and even stretch them.The MicroVice sample holder isdesigned to be easily attached to thestages of light microscopes, stereo-scopes and also on infrared and Ramanmicroscopes.You can place your sample in theexactly desired position and tightenthe two screw handles. The sample willbe hold securely under compression.Even round samples can be easily heldand won't slip. The clamps are cush-ioned and protect your sample fromdamage. The sample holder is supplied withtwo small plates that are used forclamping taut and holding films, fibers,yarns, etc. By using the two screw han-dles you can stretch the samples usingtension by user defined increments.Due to the design of the MicroVice,exact parallel stretching of the samplesis ensured.Additionally, the fixed sample canalso be tilted up to a certain angle forcorrecting oblique sample orientation. Contact: S.T. Japan-Europe